We hope you can join us for the first ever Spack User Meeting (SUM) in Chicago, IL on May 7th and 8th, 2025, as part of the first High Performance Software Foundation (HPSFcon) conference.
What to Expect
- Updates from Spack developers We’ll give a talk on the State of the Spack ecosystem, and we’ll have technical updates on the latest features and release road map.
- User presentations We hope to feature many presentations from Spack users on their experiences and on what they’ve built with Spack.
- Poster Session There will also be a poster session at where you can showcase your work and interact with others.
- Networking Opportunities SUM is hosted in conjunction with HPSFCon, so you can meet folks from other HPC communities – including other HPSF projects.
Who Should Attend:
Anyone in the Spack community: users, developers, dev-ops, system administrators, user support staff, or anyone interested in learning more.
Why Attend SUM / HPSFcon:
We think it’s time we gave our users a forum to present what they’re building with Spack. This the first ever in-person Spack user meeting, and we’re hoping to learn about all the things you’re building. So far, the Spack community has gotten together at BOF sessions at conferences, exchanged comments on GitHub, and has been very active on Slack. The inaugural SUM meeting will give us an even higher bandwidth, interactive venue to exchange ideas and to get a better sense of the needs of the community.
SUM is also part of HPSFcon, which is the first-ever conference of the High Performance Software Foundation, bringing together the community of developers and users of open-source software for high-performance computing. This is a unique opportunity to learn about the latest trends and technologies in HPC and connect with leaders in the field.
Call for Submissions:
We are seeking presentations and lightning talks for SUM.
20-minute presentations: Share your experiences using Spack - any and all spack-related topics are welcome!
- User experience reports with Spack
- Best practices for using Spack in different environments
- Tools, applications, and other software you’ve built on top of Spack
- Best practices and deployment stories
- Unique use cases for Spack
- War stories and other problems you’ve encountered
- Suggestions for features and improvements
- Integration of Spack into DevOps pipelines, applications, and unique environments
- and, yes, all your pain points – we want to know how we can improve Spack!
Submission Deadline: February 23, 2025
Please submit your abstracts through the HPSFcon submission system.
Registration:
Registration for HPSFcon is open now. Register on the official HPSFcon website.
We look forward to seeing you in Chicago!
Frequently Asked Questions (FAQ)
Q: What if I only want to attend the Spack User Group (SUM) meeting?
A: You still need to register for HPSFcon. There is no separate registration process for the SUM meeting.
Q: Is there a virtual attendance option for the SUM meeting?
A: The 2025 Spack User Meeting will be held in-person at HPSFcon in Chicago. This provides a valuable opportunity for face-to-face interaction with Spack developers and other users in the community.
We do plan to record talks and make them available online, after the event, but we encourage you to attend in person.